VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC8166
2.488 Gbit/sec
1:16 SONET/SDH Demux with Clock Recovery
Figure 5: High Speed Serial Data Inputs
Chip Boundary
VCC = 3.3V
ZO
CIN
50Ω
CAC
VTerm
50Ω
CIN
ZO
CIN TYP = 100 pF
CAC TYP = 100pF
VEE = 0V
Supplies
This device is specified as a LVPECL device with a single positive 3.3V supply. Should the user desire to
use the device in a ECL environment with a negative 3.3V supply, then VCC will be ground and VEE will be -
3.3V.
Decoupling of the power supplies is a critical element in maintaining the proper operation of the part. It is
recommended that the VCC power supply be decoupled using a 0.1µF and 0.01µF capacitor placed in parallel on
each VCC power supply pin as close to the package as possible. If room permits, a 0.001µF capacitor should
also be placed in parallel with the 0.1µF and 0.01µF capacitors mentioned above. Recommended capacitors are
low inductance ceramic SMT X7R devices. For the 0.1µF capacitor, a 0603 package should be used. The
0.01µF and 0.001µF capacitors can be either 0603 or 0403 packages.
For low frequency decoupling, 47µF tantalum low inductance SMT caps should be sprinkled over the
board’s main +3.3V power supply and placed close to the C-L-C pi filter.
If the device is being used in an ECL environment with a -3.3V supply, then all references to decoupling
VCC must be changed to VEE, and all references to decoupling 3.3V must be changed to -3.3V.
G52252-0, Rev. 3.0
11/9/99
© VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
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