WED2ZL361MV 查看數據表（PDF） - White Electronic Designs Corporation

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产品描述 (功能)

生产厂家

WED2ZL361MV

1Mx36 Synchronous Pipeline Burst NBL SRAM

White Electronic Designs Corporation 

White Electronic Designs

WED2ZL361MV

PACKAGE DIMENSION: 119 BUMP PBGA

20.32 (0.800)

TYP

7.62 (0.300)

TYP

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

1.90 (0.075)

MAX

17.00 (0.669) TYP

A1

CORNER

1.27 (0.050)

TYP

1.27 (0.050) TYP

0.711 (0.028)

MAX

NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

23.00 (0.905)

TYP

ORDERING INFORMATION

Commercial Temp Range (0°C to 70°C)

Industrial Temp Range (-40°C to +85°C)

Part Number

WED2ZL361MV35BC

WED2ZL361MV38BC

WED2ZL361MV42BC

WED2ZL361MV50BC

Configuration

1M x 36

1M x 36

1M x 36

1M x 36

tCD (ns)

3.5

3.8

4.2

5.0

Clock

(MHz)

166

150

133

100

Part Number

WED2ZL361MV35BI

WED2ZL361MV38BI

WED2ZL361MV42BI

WED2ZL361MV50BI

Configuration

1M x 36

1M x 36

1M x 36

1M x 36

tCD (ns)

3.5

3.8

4.2

5.0

Clock

(MHz)

166

150

133

100

June 2004

Rev. 3

12

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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