WED3C7410E16M400BC 查看數據表（PDF） - White Electronic Designs Corporation

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WED3C7410E16M400BC

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBX

FIGURE 5 – PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

Side profile of the CBGA package to indicate the direction of the top surface view.

May 2006

Rev. 9

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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