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WED3C7558M-XBX 查看數據表(PDF) - White Electronic Designs Corporation
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WED3C7558M-XBX
RISC Microprocessor Multichip Package
White Electronic Designs Corporation
WED3C7558M-XBX Datasheet PDF : 13 Pages
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White Electronic Designs
WED3C7558M-XBX
FIGURE 5 – PIN ASSIGNMENTS
Ball assignments of the 255 CBGA package as viewed from the top surface.
Side profile of the CBGA package to indicate the direction of the top surface view.
August 2002
Rev. 7
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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