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XC6801 查看數據表(PDF) - TOREX SEMICONDUCTOR

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XC6801 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
XC6801 Series
PACKAGING INFORMATION (Continued)
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125)
Ambient Temperature(℃) Power Dissipation PdmWThermal Resistance (/W)
25
600
166.67
85
240
700
600
500
400
300
200
100
0
25
Pd-TPadvs. Taグラフ
45
65
85
105
125
Ambient TemperatTuraeTa ()
16/18

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