BAB902SF(2009) 查看數據表（PDF） - ROHM Semiconductor
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BAB902SF
(Rev.:2009)
(Rev.:2009)
ROHM Semiconductor
BAB902SF Datasheet PDF : 25 Pages
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BA10358F/FV,BA10324AF/FV,BA2904SF/FV/FVM,BA2904F/FV/FVM,BA2904HFVM-C,
BA2902SF/FV/KN,BA2902F/FV/KN,BA3404F/FVM
Technical Note
●Derating curves
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.124(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja ＝ (Tj-Ta) / Pd [℃/W]
・・・・・ （Ⅰ）
Derating curve in Fig.124(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package
condition, wind velocity, etc even when the same of package is used.
Thermal reduction curve indicates a reference value measured at a specified condition. Fig.125(a)～(d) show a derating
curve for an example of BA10358, BA10324A, BA2904S, BA2904, BA2904HFVM-C, BA3404, BA2902S, BA2902.
Power dissLipSaIのtio消n 費of電LS力I [W]
θja = ( Tj ーTa ) / Pd [℃/W]
Pd (max)
P2
θja2 < θja1
Ambient temp周er囲a温tu度re Ta [℃]
P1
θ' ja2
θ ja2
θ' ja1 θ ja1
Chip surfaceチteッmプp表e面ra温tu度re Tj [℃]
Power diss消ip費at電io力n P [W]
(a) Thermal resistance
0
25
50
75
100
Ambient tem周pe囲ra温tu度re Ta [℃ ]
(b) Derating curve
Fig. 124 Thermal resistance and derating curve
Tj ' (max) Tj (max)
125 150
1000
1000
800
662200mmWW(*9(*)1)
600
555500mmWW(*(1*02))
400
BA10358F
BA10358FV
800
70700mmWW(*131))
BA10324AFV
600
449900mmWW((**142))
400
BA 10324A F
200
200
0
0
25
50
75
100
125
Ambient周te囲m温p度er aTtua re[℃：]Ta [℃]
0
0
25
50
75
100
125
Ambient周te囲m温p度er aTtua re[℃：]Ta [℃]
110100000000
800 80800 778800mmWW((*1*35))
66060000
669900mmWW((*1*64))
559900mmWW(*(1*57))
44040000
((aa))BBAA1100335588 フfaァmミilリy
BA2904F
BA3B40A42F904F
BBAA22990044FFVV
BBAABB23AA942200994400FF44VVFHMMVFMVM-C
BA3404F
BA3404F
BA3404FVM
BA 3404FV M
((bba)))BBAA1100332244AA fフamァミilyリ
1000
887700mmWW((*1*68))
BA2902FV
800
666600mmW(*1*97)
600
61601m0mWW((**1108))
BA2902KN
BA2902F
400
BA2902SFV
22020000
BA2904SF
BA2904SFV
BA2902SKN
200
BA2902SF
0 00
000
BA2904SFVM
2255 5500 777555
111000101000055 111222555 115500
Ambient周te囲m温pe度ra Ttuar e[℃：]Ta [℃]
(c)ABAM2B90IE4SN/BTAT2E90M4/PBAE3R4A04TfUamRilEy,B[℃A2]904H
(a) BA2904 ファミリ
0
0
25
50
75
100105 125
150
Ambient 周te囲m温pe度ra tTuar e[℃：T] a [℃]
(d)BA2902S/BA2902 family
(a) BA2902 ファミリ
（*9） （*10） （*11) （*12） （*13） （*14） （*15） （*16） （*17） （*18）
6.2
5.5
7.0
4.9
6.2
5.5
4.8
7.0
5.3
4.9
When using the unit above Ta=25[℃], subtract the value above per degree[℃].
Permissible dissipation is the value when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm](cooper foil area below 3[%]) is mounted.
Fig. 125 Derating curve
Unit
[mW/℃]
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2009.05 - Rev.A
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