80960KB(1993) 查看數據表（PDF） - Intel

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80960KB
(Rev.:1993)

EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT

Intel 

80960KB

3.3. Package Thermal Specification

The 80960KB is specified for operation when case

temperature is within the range 0°C to 85°C (PGA) or

0°C to 100°C (PQFP). Measure case temperature at

the top center of the package. Ambient temperature

can be calculated from:

TJ = TC + P*θjc

TA = TJ + P*θja

TC = TA + P*[θja−θjc]

Values for θja and θjc for various airflows are given in

Table 12 for the PGA package and in Table 12 for the

PQFP package. The PGA’s θja can be reduced by

adding a heatsink. For the PQFP, however, a heatsink

is not generally used since the device is intended to

be surface mounted.

Maximum allowable ambient temperature (TA)

permitted without exceeding TC is shown by the

graphs in Figures 23, 24, 25 and 26. The curves

assume the maximum permitted supply current (ICC)

at each speed, VCC of +5.0 V and a TCASE of +85°C

(PGA) or +100°C (PQFP).

If the 80960KB is to be used in a harsh environment

where the ambient temperature may exceed the limits

for the normal commercial part, consider using an

extended temperature device. These components are

designated by the prefix “TA” and are available at 16,

20 and 25 MHz in the ceramic PGA package.

Extended operating temperature range is –40° C to

+125°C (case).

Figure 26 shows the maximum allowable ambient

temperature for the 20 MHz extended temperature

TA80960KB at various airflows. The curve assumes

an ICC of 420 mA, VCC of 5.0 V and a TCASE of

+125°C.

Table 14. 80960KB PGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

0

50

100

200

400

600

800

(0) (0.25) (0.50) (1.01) (2.03) (3.04) (4.06)

θ Junction-to-Case

2

2

2

2

2

2

2

θ Case-to-Ambient

(No Heatsink)

19

18

17

15

12

10

9

θ Case-to-Ambient

(Omnidirectional

16

15

14

12

9

7

6

Heatsink)

θ Case-to-Ambient

(Unidirectional

15

14

13

Heatsink)

NOTES:

1. This table applies to 80960KB PGA plugged into

socket or soldered directly to board.

2. θJA = θJC + θCA

11

8

6

5

3. θJ-CAP = 4°C/W (approx.)

θJ-PIN = 4°C/W (inner pins) (approx.)

θJ-PIN = 8°C/W (outer pins) (approx.)

θJA

θJ-PIN

θJC

θJ-CAP

29

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