80960KB 查看數據表（PDF） - Intel

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80960KB

EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT

Intel 

80960KB

3.0 MECHANICAL DATA

3.1 Packaging

The 80960KB is available in two package types:

• 132-lead ceramic pin-grid array (PGA). Pins are

arranged 0.100 inch (2.54 mm) center-to-center, in

a 14 by 14 matrix, three rows around (see Figure

17).

• 132-lead plastic quad flat pack (PQFP). This

package uses fine-pitch gull wing leads arranged

in a single row along the package perimeter with

0.025 inch (0.64 mm) spacing (see Figure 20).

Dimensions for both package types are given in the

Intel Packaging handbook (Order #240800).

3.1.1 Pin Assignment

The PGA and PQFP have different pin assignments.

Figure 18 shows the view from the PGA bottom (pins

facing up) and Figure 19 shows a view from the PGA

top (pins facing down). Figure 20 shows the PQFP

package; Figure 21 shows the PQFP pinout with

signal names. Notice that the pins are numbered in

order from 1 to 132 around the package perimeter.

Table 10 and Table 11 list the function of each PGA

pin; Table 12 and Table 13 list the function of each

PQFP pin.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

A B C D E F G H J K LM N P

Figure 17. 132-Lead Pin-Grid Array (PGA) Package

21

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