ADG1408YCPZ-REEL7 查看數據表（PDF） - Analog Devices
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ADG1408YCPZ-REEL7 Datasheet PDF : 19 Pages
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Data Sheet
ADG1408/ADG1409
OUTLINE DIMENSIONS
5.10
5.00
4.90
ORDERING GUIDE
Model1
ADG1408YRUZ
ADG1408YRUZ-REEL
ADG1408YRUZ-REEL7
ADG1408YCPZ-REEL7
ADG1409YRUZ
ADG1409YRUZ-REEL
ADG1409YRUZ-REEL7
ADG1409YCPZ-REEL7
1 Z = RoHS Compliant Part.
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.65
BSC
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
2.60
2.50 SQ
2.40
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.50
0.40
9
8
4
5
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-26)
Dimensions shown in millimeters
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
Package Option
RU-16
RU-16
RU-16
CP-16-26
RU-16
RU-16
RU-16
CP-16-26
©2006–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04861-0-6/16(D)
Rev. D | Page 19 of 19
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