LP62E16512-I(2002) 查看數據表（PDF） - AMIC Technology

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LP62E16512-I
(Rev.:2002)

512K X 16 BIT LOW VOLTAGE CMOS SRAM

AMIC Technology 

Package Information

48LD CSP ( 8 x 10 mm ) Outline Dimensions

(48TFBGA)

TOP VIEW

Ball*A1 CORNER

123456

A

B

C

D

E

F

G

H

SIDE VIEW

LP62E16512-I Series

unit: mm

BOTTOM VIEW

Ball#A1 CORNER

0.10 S C

0.25 S C A B

b (48X)

654321

A

B

C

D

E

F

G

H

B

e

D1

A

D

0.20(4X)

C SEATING PLANE

Dimensions in mm

Symbol

MIN. NOM. MAX.

Notes:

A

---

--- 1.20

A1

0.20 0.25 0.30

A2

0.48 0.53 0.58

D

7.90 8.00 8.10

E

9.90 10.00 10.10

D1

--- 3.75 ---

E1

--- 5.25 ---

e

--- 0.75 ---

b

0.30 0.35 0.40

1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS

ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).

2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL

CROWNS OF THE SOLDER BALLS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM.

4. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF

THE SOLDER BALL AND THE BODY EDGE.

5. BALL PAD OPENING OF SUBSTRATE IS Φ 0.3mm (SMD)

SUGGEST TO DESIGN THE PCB LAND SIZE AS Φ 0.3mm (NSMD)

PRELIMINARY (April, 2002, Version 0.0)

13

AMIC Technology, Inc.

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