B
L1
Z1
C1
Z2
Z3
Z4
C2
C3
C6
L2
Z5
DUT
L3
B
C7
C4
Z6
+
+
C8
VCC
–
C5
C1, C5 — 0.8 – 8.0 pF Johanson Gigatrim
C2, C3 — 10 pF Ceramic Chip Capacitor
C6 — 91 pF Clamped Mica, Mini–Underwood
C4 — 47 pF Ceramic Chip Capacitor
C7 — 91 pF Clamped Mica, Mini–Underwood
C8 — 1.0 µF 25 V Tantalum
B — Bead, Ferroxcube 56–590–65/3B
L1, L2 — 4 Turns, #21 AWG, 5/32″ ID
L3 — 7 Turns, #21 AWG, 5/32″ ID
Z1, Z2 — 1″ x 0.078″ Microstrip, Zo = 50 Ohms
Z3 — 0.25″ x 0.078″ Microstrip, Zo = 50 Ohms
Z4 — 0.15″ x 0.078″ Microstrip, Zo = 50 Ohms
Z5 — 0.30″ x 0.078″ Microstrip, Zo = 50 Ohms
Z6 — 1.63″ x 0.078″ Microstrip, Zo = 50 Ohms
PCB — 1/32″ Glass Teflon, εr = 2.56
Figure 1. 800 – 900 MHz Broadband Circuit
800/900 MHz BAND DATA
12
10
8
6
4
2
800
Pout = 750 mW
VCC = 12.5 Vdc
GPE
70
ηc
60
IRL
820
840
860
880
f, FREQUENCY (MHz)
50
10
15
20
25
900
Figure 2. Typical Broadband Performance
MOTOROLA RF DEVICE DATA
MRF8372R1, R2
3