TDA1517ATW 查看數據表（PDF） - NXP Semiconductors.
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TDA1517ATW Datasheet PDF : 19 Pages
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NXP Semiconductors
8 W BTL or 2 × 4 W SE power amplifier
PACKAGE OUTLINE
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads;
body width 4.4 mm; exposed die pad
Product specification
TDA1517ATW
SOT527-1
D
c
y
exposed die pad side
Z
Dh
20
11
E
A
X
HE
vM A
Eh
pin 1 index
1
e
10
wM
bp
A2
A1
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) Dh E(2) Eh
e
HE
mm
1.1
0.15 0.95
0.05 0.80
0.25
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
4.5
4.3
3.1
2.9
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT527-1
MO-153
L Lp
v
w
y
Z(1)
θ
1
0.75
0.50
0.2
0.13
0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
05-11-02
2001 Apr 17
14
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