TE28F800C3BA90 查看數據表（PDF） - Intel

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TE28F800C3BA90

Intel Advanced+ Boot Block Flash Memory (C3)

Intel 

Intel£ Advanced+ Boot Block Flash Memory (C3)

Figure 20. TSOP Package Drawing & Dimensions

Z

Pin 1

See Notes 1, 2, 3 and 4

D1

D

See Detail A

A2

E

e

See Detail B

Y

A1

Seating

Plane

A

Detail B

Detail A

C

Dimensions

b

0

L

A5 5 6 8 - 0 2

Family: Thin Small Ou-Lt ine Package

Symbol

Millimeters

Min Nom Max Notes Min

Inches

Nom Max

Notes

Package Height

A

1.200

0.047

Standoff

A1 0.050

0.002

Package Body Thickness A2 0.950 1.000 1.050

0.037 0.039 0.041

Lead Width

b

0.150 0.200 0.300

0.006 0.008 0.012

Lead Thickness

c

0.100 0.150 0.200

0.004 0.006 0.008

Plastic Body Length

D1 18.200 18.400 18.600

0.717 0.724 0.732

Package Body Width

E 11.800 12.000 12.200

0.465 0.472 0.480

Lead Pitch

e

0.500

0.0197

Terminal Dimension

D 19.800 20.000 20.200

0.780 0.787 0.795

Lead Tip Length

L

0.500 0.600 0.700

0.020 0.024 0.028

Lead Count

N

48

48

Lead Tip Angle

Ø

0°

3°

5°

0°

3°

5°

Seating Plane Coplanarity Y

0.100

0.004

Lead to Package Offset

Z

0.150 0.250 0.350

0.006 0.010 0.014

1. One dimple on package denotes Pin 1.

2. If two dimples, then the larger dimple denotes Pin 1.

3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.

4. Pin 1 will always supersede above pin one notes.

Datasheet

65

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