70FL256P0XBHI20 查看數據表（PDF） - Cypress Semiconductor
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70FL256P0XBHI20 Datasheet PDF : 16 Pages
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S70FL256P
10. Ordering Information
The ordering part number is formed by a valid combination of the following:
S70FL 256 P 0X M F
I
00 1
Packing Type (Note 1)
0 = Tray
1 = Tube
3 = 13” Tape and Reel
Model Number (Additional Ordering Options)
21 = BGA package, Uniform 256 kB sectors
20 = BGA package, Uniform 64 kB sectors
01 = SO package, Uniform 256 kB sectors
00 = SO package, Uniform 64 kB sectors
Temperature Range
I = Industrial (–40°C to + 85°C)
Package Materials
F = Lead (Pb)-free
H = Low-Halogen, Lead (Pb)-free
Package Type
Design
M = 16-pin SO package
B = 24-ball BGA 6 8 mm package, 1.00 mm pitch
w Speed
e 0X = 104 MHz
N Device Technology
r P = 0.09 µm MirrorBit® Process Technology
fo Density
256 = 256 Mbit
Device Family
d S70FL
e Cypress Stacked Memory 3.0V-Only, Serial Peripheral Interface (SPI) Flash Memory
end 10.1 Valid Combinations
m Table 10.1 lists the valid combinations configurations planned to be supported in volume for this device.
m Table 10.1 S70FL256P Valid Combinations Table
eco Base Ordering
R Part Number
Not S70FL256P
S70FL256P Valid Combinations
Speed Option
Package and
Temperature
MFI
0X
Model
Number
00
01
Packing Type
0, 1, 3
20
BHI
0, 3
21
Package Marking
70FL256P0XMFI00
70FL256P0XMFI01
70FL256P0XBHI20
70FL256P0XBHI21
Note:
1. Package Marking omits the leading “S70” and speed, package and model number.
Document Number: 002-00647 Rev. *F
Page 11 of 16
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