70FL256P0XMFI00 查看數據表（PDF） - Cypress Semiconductor

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70FL256P0XMFI00

256-Mbit 3.0V Flash

Cypress Semiconductor 

S70FL256P

5. Device Operations

5.1 Programming

Each Flash die must be programmed independently due to the nature of the dual die stack.

5.2 Simultaneous Die Operation

The user may only access one Flash die of the dual die stack at a time via its respective Chip Select.

5.3 Sequential Reads

n Sequential reads are not supported across the end of the first Flash die to the beginning of the second. If the user desires to

ig sequentially read across the two die, data must be read out of the first die via CS1# and then read out of the second die via CS2#.

Des 5.4 Sector/Bulk Erase

A sector erase command must be issued for sectors in each Flash die separately. Full device Bulk Erase via a single command is

w not supported due to the nature of the dual die stack. A Bulk Erase command must be issued for each die.

Ne 5.5 Status Register

r Each Flash die of the dual die stack is managed by its own Status Register. Reads and updates to the Status Registers must be

fo managed separately. It is recommended that Status Register control bit settings of each die are kept identical to maintain

consistency when switching between die.

ded 5.6 Configuration Register

n Each Flash die of the dual die stack is managed by its own Configuration Register. Updates to the Configuration Register control bits

e must be managed separately. It is recommended that Configuration Register control bit settings of each die are kept identical to

maintain consistency when switching between die.

omm 5.7 Block Protection

c Each Flash die of the dual die stack will maintain its own Block Protection. Updates to the TBPROT and BPNV bits of each die must

e be managed separately. By default, each die is configured to be protected starting at the top (highest address) of each array, but no

R address range is protected. It is recommended that the Block Protection settings of each die are kept identical to maintain

t consistency when switching between die.

No 6. Read Identification (RDID)

The Read Identification (RDID) command outputs the one-byte manufacturer identification, followed by the two-byte device

identification and the bytes for the Common Flash Interface (CFI) tables. Each die of the FL256P dual die stack will have identical

identification data as the FL129P die, with the exception of the CFI data at byte 27h, as shown in Table 6.1.

Table 6.1 Product Group CFI Device Geometry Definition

Byte

27h

Data

19h

Description

Device Size = 2^N byte

Document Number: 002-00647 Rev. *F

Page 6 of 16

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