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TLV4976-1K 查看數據表(PDF) - Infineon Technologies

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TLV4976-1K Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
4.3
Distance between Chip and Package
Branded Side
d: Distance chip to upper side of IC
d = 0.56 ±0.1 mm
Figure 9 Distance between chip and package
4.4
Package Marking
VD016
Year (y) = 0...9
Month (m) = 1...9,
o - October
n - November
d - December
Figure 10 Marking of TLV4976-1K
TLV4976-1K
Package Information
Data Sheet
15
Rev. 1.0, 2010-08-02

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