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LF2247 查看數據表(PDF) - LOGIC Devices

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LF2247 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
DEVICES INCORPORATED
LF2247
Image Filter with Coefficient RAM
NOTES
1. Maximum Ratings indicate stress 9. AC specifications are tested with 11. For the tENA test, the transition is
specifications only. Functional oper- input transition times less than 3 ns, measured to the 1.5 V crossing point
ation of these products at values beyond output reference levels of 1.5 V (except with datasheet loads. For the tDIS test,
those indicated in the Operating Condi- tDIS test), and input levels of nominally the transition is measured to the
tions table is not implied. Exposure to 0 to 3.0 V. Output loading may be a ±200mV level from the measured
1
maximum rating conditions for ex- resistive divider which provides for steady-state output voltage with
tended periods may affect reliability. specified IOH and IOL at an output ±10mA loads. The balancing volt-
voltage of VOH min and VOL max age, VTH, is set at 3.5 V for Z-to-0
2. The products described by this spec- respectively. Alternatively, a diode and 0-to-Z tests, and set at 0 V for Z-
2
ification include internal circuitry de- bridge with upper and lower current to-1 and 1-to-Z tests.
signed to protect the chip from damag- sources of IOH and IOL respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be 12. These parameters are only tested at
3
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF the high temperature extreme, which is
less, conventional precautions should minimum, and may be distributed.
the worst case for leakage current.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs ca- FIGURE A. OUTPUT LOADING CIRCUIT
4
avoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
3. Thisdeviceprovideshardclampingof
As a result, care must be exercised in the
testing of this device. The following
DUT
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above VCC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
S1
CL
5
IOL
VTH
IOH
6
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors FIGURE B. THRESHOLD LEVELS
7
tion will not be adversely affected, how- should be installed between device VCC
ever, input current levels will be well in and the tester common, and device OE
excess of 100 mA.
ground and tester common.
Z0
4. Actual test conditions may vary from b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
Z1
tENA
1.5 V
tDIS
1.5 V
1.5 V
VOL* 0.2 V
1.5 V
VOH* 0.2 V
8
3.5V Vth
0Z
1Z
0V Vth
9
5. Supply current for a given applica- c. Input voltages should be adjusted to
VOL* Measured VOL with IOH = –10mA and IOL = 10mA
VOH* Measured VOH with IOH = –10mA and IOL = 10mA
tion can be accurately approximated by: compensate for inductive ground and VCC
NCV2 F
noise to maintain required DUT input
levels relative to the DUT ground pin.
10
where
4
10. Each parameter is shown as a min-
11
N = total number of device outputs imum or maximum value. Input re-
C = capacitive load per output
quirements are specified from the point
V = supply voltage
of view of the external system driving
F = clock frequency
the chip. Setup time, for example, is
specified as a minimum since the exter-
6. Tested with all outputs changing ev-
ery cycle and no load, at a 30 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
nal system must supply at least that
much time to meet the worst-case re-
quirements of all parts. Responses from
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximum since worst-case operation of
any device always provides data within
that time.
Video Imaging Products
7
08/16/2000–LDS.2247-H

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