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STD100NH02L(2003) 查看數據表(PDF) - STMicroelectronics

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STD100NH02L Datasheet PDF : 12 Pages
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STD100NH02L
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
1.5
Rthj-amb Thermal Resistance Junction-ambient
Max
100
Tl
Maximum Lead Temperature For Soldering Purpose
275
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 25 mA, VGS = 0
24
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = 20 V
VDS = 20 V TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
±100
nA
ON (5)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 5 V
ID = 30 A
ID = 15 A
Min.
1
Typ. Max.
1.8
0.0042 0.0048
0.005 0.009
Unit
V
DYNAMIC
Symbol
gfs (5)
Ciss
Coss
Crss
RG
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Gate Input Resistance
Test Conditions
VDS = 10 V
ID = 30 A
VDS = 15V f = 1 MHz VGS = 0
Min.
f = 1 MHz Gate DC Bias = 0
Test Signal Level = 20 mV
Open Drain
Typ.
50
3940
1020
110
1.1
Max.
Unit
S
pF
pF
pF
2/12

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