Electrical and Thermal Characteristics
Table 19. Standard SDRAM Write Timing
Sym
tmem_clk
tvalid
thold
DMvalid
DMhold
datavalid
datahold
Description
Min
MEM_CLK period
7.5
Control Signals, Address and MBA Valid
—
after rising edge of MEM_CLK
Control Signals, Address and MBA Hold after
rising edge of MEM_CLK
tmem_clk*0.5
DQM valid after rising edge of MEM_CLK
—
DQM hold after rising edge of Mem_clk
MDQ valid after rising edge of MEM_CLK
tmem_clk*0.25-0.7
—
MDQ hold after rising edge of MEM_CLK
tmem_clk*0.75-0.7
Max
—
tmem_clk*0.5+0.4
—
tmem_clk*0.25+0.4
—
tmem_clk*0.75+0.4
—
Units SpecID
ns
A5.8
ns
A5.9
ns A5.10
ns A5.11
ns A5.12
ns A5.13
ns A5.14
MEM_CLK
Control Signals
DQM (Data Mask)
MDQ (Data)
MA (Address)
MBA (Bank Selects)
tvalid
thold
Active
NOP WRITE
NOP
DMvalid
DMhold
NOP NOP
datavalid
tvalid
tvalid
thold
Row
thold
datahold
Column
NOP
NOP
NOTE: Control Signals are composed of RAS, CAS, MEM_WE, MEM_CS, MEM_CS1 and CLK_EN
Figure 6. Timing Diagram—Standard SDRAM Memory Write Timing
3.3.5.3 Memory Interface Timing-DDR SDRAM Read Command
The SDRAM Memory Controller uses a 1/4 period delayed MDQS strobe to capture the MDQ data. The
1/4 period delay value is calculated automatically by hardware.
MPC5200B Data Sheet, Rev. 1
Freescale Semiconductor
21