NX25F011B 查看數據表（PDF） - Unspecified

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产品描述 (功能)

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NX25F011B

1M-BIT, 2M-BIT, AND 4M-BIT SERIAL FLASH MEMORIES WITH 4-PIN SPI INTERFACE

Unspecified 

NX25F011B

NX25F021B

NX25F041B

PACKAGING INFORMATION

200-mil Plastic SOIC

Package Code: (S)

1

N

2

EH

3

4

1

D

SEATING PLANE

A

5

B

e

A1

L

=

C

6

7

200 mil Plastic SOIC (S)

Symbol

No. Leads

A

A1

B

C

D

E

e

H

L

α

Millimeters

Min

Max

8

1.780 2.030

0.102 0.330

0.305 0.508

0.178 0.254

5.160 5.380

5.210 5.410

1.27BSC

7.62 8.38

0.508

0o

0.889

8o

Inches

Min

Max

0.070 0.080

0.004 0.013

0.012 0.020

0.007 0.010

0.203 0.212

0.205 0.213

0.050 BSC

0.300 0.330

0.020

0o

0.035

8o

8

9

Notes:

1. Controlling dimensions: inches, unless otherwise

specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash

protrusions and should be measured from the

bottom of the package.

4. Formed leads shall be planar with respect to one

another within .0004 inches at the seating plane.

10

11

12

NexFlash Technologies, Inc.

33

PRELIMINARY NXSF016F-1201

12/12/01 ©

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