ISL83080EIB(2005) 查看數據表（PDF） - Intersil
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ISL83080EIB
(Rev.:2005)
(Rev.:2005)
Intersil
ISL83080EIB Datasheet PDF : 18 Pages
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ISL83080E, ISL83082E, ISL83083E, ISL83085E, ISL83086E, ISL83088E
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
A, B, Y, Z (Transient Pulse Through 100Ω) . . . . . . . . . . . . . ±25V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C
(Note 4)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C) MIN
TYP MAX UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
Driver Differential VOUT (with load)
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
VOD1
VOD2
∆VOD
RL = 100Ω (RS-422) (Figure 1A)
RL = 54Ω (RS-485) (Figure 1A)
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B)
RL = 54Ω or 100Ω (Figure 1A)
Full
-
Full
2
-
VCC
V
2.9
-
V
Full 1.5
2.4
VCC
V
Full 1.5
2.6
-
V
Full
-
0.01 0.2
V
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
VOC
∆VOC
RL = 54Ω or 100Ω (Figure 1A)
RL = 54Ω or 100Ω (Figure 1A)
Full
-
2.85
3
V
Full
-
0.01 0.1
V
Logic Input High Voltage
Logic Input Low Voltage
DI Input Hysteresis Voltage
Logic Input Current
Input Current (A, B)
Output Leakage Current (Y, Z)
(Full Duplex Versions Only)
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex)
Driver Short-Circuit Current,
VO = High or Low
Receiver Differential Threshold
Voltage
VIH
VIL
VHYS
IIN1
IIN2
IIN3
IIN3
IOSD1
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE = 0V, VCC = 0V or 5.5V VIN = 12V
VIN = -7V
RE = 0V, DE = 0V, VCC = 0V VIN = 12V
or 5.5V
VIN = -7V
RE = VCC, DE = 0V, VCC = 0V VIN = 12V
or 5.5V
VIN = -7V
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 6)
VTH
-7V ≤ VCM ≤ 12V
Full
2
Full
-
25
-
Full
-2
Full
-
Full -75
Full
-
Full -75
Full
-
Full -20
Full
-
-
-
V
-
0.8
V
100
-
mV
-
2
µA
70
125 µA
55
-
µA
7
125 µA
11
-
µA
0
20
µA
9
-
µA
-
±250 mA
Full -200 -90
-50 mV
Receiver Input Hysteresis
∆VTH VCM = 0V
25
-
20
-
mV
5
FN6085.6
September 12, 2005
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