TDA8944J 查看數據表（PDF） - NXP Semiconductors.

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TDA8944J

2 x 7 W stereo Bridge Tied Load (BTL) audio amplifier

NXP Semiconductors. 

NXP Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

18. Revision history

Table 11: Revision history

Rev Date CPCN

Description

02 000214 -

Product specification; second version; supersedes initial version TDA8944J-01 of

14 April 1999 (9397 750 04881). Modifications:

• Table 1 on page 1: SVRR; Typ value 65 dB → added

• Figure 1 on page 2: Block diagram; pin numbers changed OUT2− → 14 and OUT2+ → 17

• Figure 2 on page 3: Pin configuration; pin numbers changed OUT2− → 14 and OUT2+ → 17

• Section 8 “Functional description”:

– Section 8.1 “Input configuration” on page 4 → added.

– Section 8.2 “Power amplifier” on page 5: ........, capable of delivering a peak output

current of 1.5 A → changed to 2 A.

– Section 8.2.1 “Output power measurement” on page 5 → added

– Section 8.2.2 “Headroom” on page 5 → added

• Section 8.3 “Mode selection”:

– Standby mode: VMODE > (VCC − 0.5 V) → changed to (VCC − 0.5 V) < VMODE < VCC; The

power consumption of the TDA8944J will be reduced to <0.18 mW → added.

– Mute mode: the DC level of the input and output pins remain on half the supply

voltage → added;

– 2.5 V < VMODE < (VCC − 1.5 V) → changed to 3 V < VMODE < (VCC − 1.5 V)

– Section 8.3.1 “Switch-on and switch-off” on page 6

• Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added

• Section 8.5 “Built-in protection circuits” on page 6 → added

• Table 5 on page 7:

– Ptot value added 18 V

– VCC(sc) value added 15 V

• Table 6 on page 7:

– Rth(j-a) value added 40 K/W

– Rth(j-c) value 10 → changed to 6.9 K/W; condition ‘in free air’ → changed to ‘both channels

driven’

• Table 7 on page 7: VMODE - mute mode - value Min 2.5 → changed to 3 V

• Table 8 on page 8:

– SVRR; Typ values 65 and 60 dB → added

– αcs; Typ value 75 dB → added

• Figure 3 to 13: figures added

• Section 13 “Internal circuitry” on page 12: → added

• Figure 14: figure adjusted

• Section 14.1 “Printed-circuit board (PCB)” on page 13: → added

• Figure 15: figure added

• Section 14.2 “Thermal behaviour and heatsink calculation” on page 15: → added

• Section 15.2 “Test conditions” on page 15: → added

01 990414 -

Preliminary specification; initial version.

9397 750 06861

Product specification

Rev. 02 — 14 February 2000

© NXP B.V. 2010. All rights reserved.

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