AN17820B 查看數據表（PDF） - Panasonic Corporation

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AN17820B

Dual channel BTL 7.5 W audio power amplifier with volume and standby control

Panasonic Corporation 

AN17820B

„ Usage Notes

1. This IC is intended to be used for general electronic equipment.

Consult our sales staff in advance for information on the following applications:

x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may

directly jeopardize life or harm the human body.

x Any applications other than the standard applications intended.

(1) Space appliance (such as artificial satellite, and rocket)

(2) Traffic control equipment (such as for automobile, airplane, train, and ship)

(3) Medical equipment for life support

(4) Submarine transponder

/ (5) Control equipment for power plant

(6) Disaster prevention and security device

e (7) Weapon

. (8) Others: Applications of which reliability equivalent to (1) to (7) is required

c tage 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might

n d le s smoke or ignite.

a e lifecyc 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In

t addition, refer to the „ Pin Description for the pin configuration.

n u roduc 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-

P bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because

te tin ur the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during

g fo e . transportation.

in n llowin ce typ ation 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin

fo an pe ed rm – VCC short (power supply fault), output pin – GND short (ground fault), output-to-output-pin short (load short), or pin shift and,

a o ludes inten e ty typ info n/ safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke

c d t /e emission will depend on the current capability of the power supply.

c ued inc ned maintenanontinue d type t lates .co.jp 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

M is tin la a isc ue ou nic (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

p m d tin ab so maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

con ed on L na defect which may arise later in your equipment.

is lan isc UR .pa Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

e/D p d ing on mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

ic or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

Dtenanc follow .sem 7. When using the LSI for new models, verify the safety including the long-term reliability for each product.

Main e visit ://www 8. When the application system is designed by using this LSI, be sure to confirm notes in this book.

Pleas http Be sure to read the notes to descriptions and the usage notes in the book.

9. Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground.

10. The thermal protection circuit operates at a Tj of approximately 150°C. The thermal protection circuit is reset automatically when

the temperature drops.

11. Make sure that the heat radiation design is effective enough if the VCC is comparatively high or the IC operates at high output

power.

12. Connect only ground pin for signal sources to the signal GND pin of the amplifier on the previous stage.

13. For installation to heat-sink, grease for heat-sink should be applied to reduce the contact heat resistance and increase the radiating

effect. Ensure that there is no foreign objects between IC and heat-sink which may cause cracks and additional stress to the IC.

SDB00167BEB

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