NXP Semiconductors
1PS79SB10
Schottky barrier single diode
10. Soldering
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
2.15
1.4
SOD523
1.2
0.5 0.6
(2×) (2×)
0.4
(2×)
0.5
(2×)
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
Fig. 5. Reflow soldering footprint for SOD523 (SOD523)
sod523_fr
11. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
1PS79SB10 v.2
20120814
Product data sheet
-
1PS79SB10 v.1
Modifications:
• The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package outline drawing replaced by minimized package outline drawing.
• Section "Test information" added.
• Section "Soldering" added.
1PS79SB10 v.1
19980716
Product data sheet
-
-
1PS79SB10
Product data sheet
All information provided in this document is subject to legal disclaimers.
14 August 2012
© NXP B.V. 2012. All rights reserved
5/8