NCS2200 查看數據表（PDF） - ON Semiconductor

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NCS2200

Comparators, 0.85 V to 6 V, 10 μA, 1 μs, Rail-to-Rail, Open Drain and Push-Pull Outputs

ON Semiconductor 

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

1

SCALE 8:1

D

A

B

UDFN6, 1.2x1.0, 0.4P

CASE 517AA−01

ISSUE D

EDGE OF PACKAGE

PIN ONE

REFERENCE

2X

0.10 C

ÉÉÉÉÉÉ

TOP VIEW

2X

0.10 C

0.10 C

10X

0.08 C

SIDE VIEW

L1

E

DETAIL A

Bottom View

(Optional)

ÉÉÉÉÉÉ EXPOSED Cu

MOLD CMPD

A3

(A3)

A

A1

DETAIL B

Side View

(Optional)

SEATING

PLANE

A1

C

DATE 03 SEP 2010

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

A3 0.127 REF

b 0.15 0.25

D 1.20 BSC

E 1.00 BSC

e 0.40 BSC

L 0.30 0.40

L1 0.00 0.15

L2 0.40 0.50

GENERIC

MARKING DIAGRAM*

XM

1

L2

5X L

3

X = Specific Device Code

M = Date Code

6X b

0.10 C A B

6

0.05 C NOTE 3

4

e

BOTTOM VIEW

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

MOUNTING FOOTPRINT*

6X

0.42

6X

0.22

0.40

PITCH

1.07

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

DOCUMENT NUMBER:

DESCRIPTION:

98AON22068D

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

6 PIN UDFN, 1.2X1.0, 0.4P

PAGE 1 OF 1

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