A700X227M006ATE015 查看數據表（PDF） - Unspecified
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A700X227M006ATE015 Datasheet PDF : 26 Pages
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Aluminum Organic Capacitor (AO-CAP)
A700 Series Polymer Aluminum
Soldering Process
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
profile conditions for convection and IR reflow reflect the profile
conditions of the IPC/J–STD–020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions.
Please note that although the X/7343–43 case size can withstand
wave soldering, the tall profile (4.3 mm maximum) dictates care in
wave process development.
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (ts) from Tsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
Ramp-up Rate (TL to TP)
3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (tP)
Ramp-down Rate (TP to TL)
Time 25°C to Peak
Temperature
20 seconds maximum
6°C/seconds maximum
6 minutes maximum
30 seconds maximum
6°C/seconds maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
TP
Maximum Ramp Up Rate = 3ºC/seconds
tP
Maximum Ramp Down Rate = 6ºC/seconds
TL
tL
Tsmax
Tsmin
tS
25
25ºC to Peak
Time
Storage
All AO-CAP series are shipped in moisture barrier bags with a desiccant and moisture indicator card. These series are classified
as MSL3 (Moisture Sensitivity Level 3). Product contained within the moisture barrier bags should be stored in normal working
environments with temperatures not to exceed 40°C and humidity not in excess of 60% RH.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
TC1T1220_2A0L_PAO70LY0 • 12/31/2014 115
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