ESDALC5-1BF4 查看數據表（PDF） - STMicroelectronics

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ESDALC5-1BF4

Low clamping and low capacitance bidirectional single line ESD protection

STMicroelectronics 

Recommendation on PCB assembly

3

Recommendation on PCB assembly

ESDALC5-1BF4

3.1

Stencil opening design

1. General recommendations on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 13. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio

=

W-----

T

≥

1,5

Aspect Area = 2----T---L-(---L-×----+-W----W------) ≥ 0,66

2. Recommended stencil window

a) Stencil opening thickness: 80 µm

b) Other dimensions: see Figure 14

Figure 14. Recommended stencil window position, stencil opening thickness: 80 µm

0.656

(0.0258)

0.230

(0.0091)

0.643

(0.0253)

0.183

(0.0072)

0.007 0.007

(0.00027) (0.00027)

Footprint

0.170

(0.0067)

0.243

(0.0096)

mm

(inches)

Stencil window

6/10

DocID024341 Rev 1

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