ESDALC5-1BF4 查看數據表（PDF） - STMicroelectronics

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ESDALC5-1BF4

Low clamping and low capacitance bidirectional single line ESD protection

STMicroelectronics 

Recommendation on PCB assembly

ESDALC5-1BF4

3.5

Note:

Reflow profile

Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

100

0.9 °C/s

50

0

30

60

90

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s

-3 °C/s

-6 °C/s

Time (s)

120 150 180 210 240 270 300

Minimize air convection currents in the reflow oven to avoid component movement.

8/10

DocID024341 Rev 1

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