TFA9843J 查看數據表（PDF） - NXP Semiconductors.

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TFA9843J

2-channel audio amplifier (SE: 1 W to 20 W or BTL: 4 W to 40 W)

NXP Semiconductors. 

Philips Semiconductors

TFA9843J

2-channel audio amplifier (2 x SE or 1 x BTL)

AUDIO POWER CS NIJMEGEN

TVA

TFA9843J

100 nF

220

nF

CIV

22

µF

SGND

CIV

IN2+

220

nF

IN1+

1000 µF

150 µF

10

+VP kΩ

MODE

10 kΩ

SB ON

MUTE

Fig 21. Printed-circuit board layout (single-sided); components view.

MCE506

13.2.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage

ripple rejection. The respective capacitor location should be as close as possible to

the device and grounded to the power ground. Proper power supply decoupling also

prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor

with low ESR, typical 100 nF, has to be placed as close as possible to the device. For

suppressing lower frequency noise and ripple signals, a large electrolytic capacitor,

e.g. 1000 µF or greater, must be placed close to the device.

The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail

voltage. For good THD and noise performance a low ESR capacitor is recommended.

9397 750 12587

Preliminary data

13.3 Thermal behavior and heatsink calculation

The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W.

A calculation for the heatsink can be made, with the following parameters:

Tamb(max) = 60 °C (example)

VCC = 18 V and RL = 4 Ω (SE)

Tj(max) = 150 °C (specification)

Rth(tot) is the total thermal resistance between the junction and the ambient including

the heatsink. This can be calculated using the maximum temperature increase

divided by the power dissipation:

Rth(tot) = (Tj(max) − Tamb(max))/PD

Rev. 02 — 19 January 2004

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

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