ISP817ASMTR 查看數據表（PDF） - Unspecified

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ISP817ASMTR

OPTOISO 5.3KV TRANS 4DIP

Unspecified 

ISP817, ISP827, ISP847

IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD

One Time Reflow Soldering is Recommended.

Do not immerse device body in solder paste.

260°C

TP

TP - 5°C

TL 217°C

Tsmax 200°C

Tsmin 150°C

Max Ramp Up Rate

3°C/s

ts Preheat

60s – 120s

tP

Max Ramp Down Rate

6°C/s

TL

25°C

Time 25°C to Peak Temperature

TIME (s)

Profile Details

Preheat

- Min Temperature (TSMIN)

- Max Temperature (TSMAX)

- Time TSMIN to TSMAX (ts)

Soldering Zone

- Peak Temperature (TP)

- Time at Peak Temperature

- Liquidous Temperature (TL)

- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)

- Time maintained above TL (tL)

- Ramp Up Rate (TL to TP)

- Ramp Down Rate (TP to TL)

Average Ramp Up Rate (Tsmax to TP)

Time 25°C to Peak Temperature

Conditions

150°C

200°C

60s - 120s

260°C

10s max

217°C

30s max

60s - 100s

3°C/s max

6°C/s max

3°C/s max

8 minutes max

14 07/11/2017

DD93227

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