SFH4655(2005) 查看數據表（PDF） - OSRAM GmbH
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SFH4655 Datasheet PDF : 8 Pages
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Vorläufige Daten / Preliminary Data
Empfohlenes Lötpaddesign
Recommended Solderpad Design
Bauteil positioniert
Component location on pad
SFH 4650, SFH 4655
1.7
Paddesign for improved
heat dissipation
2
Cu-area
Bauteil positioniert
Component location on pad
Solder resist
OHF02421
2005-03-08
2.4
Paddesign for improved
heat dissipation
2
Cu-area
Solder resist
OHF02422
7
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