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MPU-9150 查看數據表(PDF) - Unspecified

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MPU-9150 Datasheet PDF : 50 Pages
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MPU-9150 Product Specification
Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013
Temperature Set Points Corresponding to Reflow Profile Above
Step Setting
CONSTRAINTS
Temp (°C) Time (sec)
Max. Rate (°C/sec)
A
Troom
B
TSmin
C
TSmax
D
TLiquidus
E
TPmin [255°C, 260°C]
F
TPmax [ 260°C, 265°C]
G
TPmin [255°C, 260°C]
25
150
200
217
255
260
255
60 < tBC < 120
tAF < 480
10< tEG < 30
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
H
I
Notes:
TLiquidus
217
60 < tDH < 120
Troom
25
Customers must never exceed the Classification temperature (TPmax = 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and
ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we
used for qualification, as these represent the maximum tolerable ratings for the device.
11.6 Storage Specifications
The storage specification of the MPU-9150 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level
(MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168 hours -- Storage conditions: ambient ≤30°C at 60%RH
11.7 Package Marking Specification
TOP VIEW
Part number
Lot traceability code
InvenSense
MPU9150
XXXXXX-XX
XX YYWW X
Foundry code
Package Vendor Code
Rev Code
YY = Year Code
WW = Work Week
Package Marking Specification
Proprietary and Confidential
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