MT46V16M16P-6 查看數據表（PDF） - Micron Technology

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MT46V16M16P-6

256Mb: x4, x8, x16 DDR SDRAM

Micron Technology 

256Mb: x4, x8, x16

DDR SDRAM

Figure 55: 60-Ball FBGA (14 x 8mm)

0.850 ±0.075

SEATING PLANE

C

0.10 C

60X ∅0.45

SOLDER BALL DIAMETER

REFERS TO POST REFLOW

CONDITION. THE PRE-

REFLOW DIAMETER IS Ø 0.40

BALL A9

6.40

0.80 TYP

PIN A1 ID

BALL A1

1.00 TYP

1.20 MAX

PIN A1 ID

11.00

5.50 ±0.05

CL

14.00 ±0.10

7.00 ±0.05

CL

3.20 ±0.05

4.00 ±0.05

8.00 ±0.10

NOTE:

All dimensions are in millimeters.

Data Sheet Designation

This data sheet contains minimum and maximum

limits specified over the complete power supply and

temperature range for production devices. Although

considered final, these specifications are subject to

change, as further product development and data

characterization sometimes occur.

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

SOLDER BALL MATERIAL: EUTECTIC 62% Sn, 36% Pb, 2%Ag

SOLDER BALL PAD: Ø .33mm

®

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992

Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

09005aef8076894f

256MBDDRx4x8x16_2.fm - Rev. F 6/03 EN

80

Micron Technology, Inc., reserves the right to change products or specifications without notice..

©2003 Micron Technology, Inc

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