LM393Q8 查看數據表（PDF） - Cystech Electonics Corp.
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LM393Q8 Datasheet PDF : 6 Pages
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SO-8 Dimension
Top View
A
B
CYStech Electronics Corp.
Spec. No. : C545Q8
Issued Date : 2007.04.16
Revised Date : 2012.09.17
Page No. : 6/6
Right side View
G
I
CH
Marking:
Date Code
LM393
□□□□
D
E
Front View
Part A
F
J
K
Part A L
M
N
O
8-Lead SO-8 Plastic Package
CYStek Package Code: Q8
DIM
Inches
Min.
Max.
A 0.1909 0.2007
B 0.1515 0.1555
C 0.2283 0.2441
D 0.0480 0.0519
E 0.0145 0.0185
F 0.1472 0.1527
G 0.0570 0.0649
H 0.1889 0.2007
Millimeters
Min.
Max.
4.85
5.10
3.85
3.95
5.80
6.20
1.22
1.32
0.37
0.47
3.74
3.88
1.45
1.65
4.80
5.10
DIM
Inches
Min.
Max.
I
0.0019 0.0078
J
0.0118 0.0275
K 0.0074 0.0098
L 0.0145 0.0204
M 0.0118 0.0197
N 0.0031 0.0051
O 0.0000 0.0059
*: Typical
Millimeters
Min.
Max.
0.05
0.20
0.30
0.70
0.19
0.25
0.37
0.52
0.30
0.50
0.08
0.13
0.00
0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LM393Q8
CYStek Product Specification
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