N25Q128A13TF8H0E 查看數據表（PDF） - Numonyx -> Micron

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N25Q128A13TF8H0E

128-Mbit 3 V, multiple I/O, 4-Kbyte subsector erase on boot sectors, XiP enabled, serial flash memory with 108 MHz SPI bus interface

Numonyx -> Micron 

N25Q128 - 3 V

15 Package mechanical

Package mechanical

In order to meet environmental requirements, Numonyx offers these devices in RoHS

compliant packages. These packages have a lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

Figure 108. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,

8 × 6 mm, package outline

D

E

E2

e

b

A

A1

D2

L

K

L1

ddd

VDFPN-02

1. Drawing is not to scale.

2. The circle in the top view of the package indicates the position of pin 1.

Table 34.

Symbol

VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,

8 × 6 mm, package mechanical data

Millimeters

Inches

Typ

Min

Max

Typ

Min

A

0.85

1.00

0.033

A1

0.00

0.05

0.000

b

0.40

0.35

0.48

0.016

0.014

D

8.00

D2

5.16

0.315

(1)

0.203

ddd

0.05

E

6.00

0.236

E2

4.80

0.189

e

1.27

–

–

0.050

–

K

0.82

0.032

L

0.50

0.45

0.60

0.020

0.018

L1

0.15

N

8

8

1. D2 Max must not exceed (D – K – 2 × L).

Max

0.039

0.002

0.019

0.002

–

0.024

0.006

173/180

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