NX25F011A-5VE-R 查看數據表（PDF） - NexFlash -> Winbond Electronics

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产品描述 (功能)

生产厂家

NX25F011A-5VE-R

1M-BIT AND 4M-BIT SERIAL FLASH MEMORIES WITH 4-PIN SPI INTERFACE

NexFlash -> Winbond Electronics 

NX25F011A

NX25F041A

PACKAGE INFORMATION

Plastic TSOP - 28-pins

Package Code: V (Type I)

1

EH

N

D

SEATING PLANE

A

e

B

A1

L

α

C

Plastic TSOP (V—Type I)

Millimeters

Inches

Symbol Min Max

Min Max

Ref. Std.

No. Leads

28

A

1.00 1.20 0.039 0.047

A1

0.05 0.20 0.002 0.008

B

0.15 0.25 0.006 0.010

C

0.10 0.20 0.004 0.008

D

7.90 8.10 0.311 0.319

E

11.60 11.80 0.457 0.465

H

13.30 13.50 0.524 0.531

e

0.55 BSC

0.022 BSC

L

0.50 0.70 0.020 0.028

α

0° 5°

0°

5°

Notes:

1. Controlling dimension: millimeters, unless other-

wise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash

protrusions and should be measured from the bottom

of the package.

4. Formed leads shall be planar with respect to one

another within 0.004 inches at the seating plane.

24

NexFlash Technologies, Inc.

PRELIMINARY NXSF014B-0699

06/11/99

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