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CDNBS08-SLVU2.8-8 查看數據表(PDF) - Bourns, Inc

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产品描述 (功能)
生产厂家
CDNBS08-SLVU2.8-8
Bourns
Bourns, Inc Bourns
CDNBS08-SLVU2.8-8 Datasheet PDF : 4 Pages
1 2 3 4
*RoHS COMPLIANT
Features
RoHS compliant*
Protects up to four I/O ports
Bidirectional configuration
ESD protection
Low capacitance: 6 pF
Applications
Ethernet - 10/100/1000 Base T
Personal digital assistants
Handheld electronics
Cellular phones
Video cards
CDNBS08-SLVU2.8-8 - Low Capacitance TVS Array
General Information
The markets of portable communications, computing and video equipment are challenging
the semiconductor industry to develop increasingly smaller electronic components.
Bourns offers Transient Voltage Suppressor Array combination diodes for surge and ESD
protection applications in an eight lead narrow body SOIC package size format. Bourns®
Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place
equipment and their flat configuration minimizes roll away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Min.
Peak Pulse Current (tp= 8/20 µs)
Peak Pulse Power (tp= 8/20 µs) 1
Working Voltage
IPP
PPP
VWM
Breakdown Voltage @ 1 mA
Leakage Current @ VWM
Capacitance @ 0 V, 1 MHz
VBR
3.0
ID
C
Snapback Voltage @ 50 mA
2.8
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
ESD
±8
±15
EFT Protection per IEC 61000-4-4 @ 5/50 ns
EFT
Surge Protection per @ IP = 5 A 2
VC
IEC 61000-4-5
Clamping Voltage @ IP = 24 A 2
VC
@ 8/20 µs
@ IPP = 30 A 2
VC
Notes:
1. See Peak Pulse Power vs. Pulse Time.
2. Each differential line pair.
Nom.
6
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Junction Temperature Range
Storage Temperature Range
Symbol
TJ
TSTG
Min.
-55
-55
Nom.
+25
+25
8
7
6
5
1
2
3
4
Max.
Unit
30
A
600
W
2.8
V
V
1.0
µA
pF
V
kV
60
A
8.5
V
15
V
17
V
Max.
Unit
+125
°C
+150
°C
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.

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