LTC2259-14 查看數據表（PDF） - Linear Technology

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LTC2259-14

14-Bit, 125/105/80Msps Ultralow Power 1.8V ADCs

Linear Technology 

LTC2261-14

LTC2260-14/LTC2259-14

PACKAGE DESCRIPTION

UJ Package

40-Lead Plastic QFN (6mm × 6mm)

(Reference LTC DWG # 05-08-1728 Rev Ø)

0.70 ±0.05

4.42 ±0.05

4.42 ±0.05

6.50 ±0.05

5.10 ±0.05

4.50 ±0.05

(4 SIDES)

0.25 ±0.05

0.50 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

PACKAGE OUTLINE

6.00 ± 0.10

(4 SIDES)

PIN 1 TOP MARK

(SEE NOTE 6)

0.75 ± 0.05

R = 0.10

TYP

4.50 REF

(4-SIDES)

R = 0.115

TYP

39 40

4.42 ±0.10

PIN 1 NOTCH

R = 0.45 OR

0.35 s 45°

CHAMFER

0.40 ± 0.10

1

2

4.42 ±0.10

0.200 REF

0.00 – 0.05

NOTE:

1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

(UJ40) QFN REV Ø 0406

0.25 ± 0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibilit y is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

226114f

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