MPC8541VTALD(2006) 查看數據表（PDF） - Freescale Semiconductor

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MPC8541VTALD
(Rev.:2006)

PowerQUICC™ III Integrated Communications Processor Hardware Specifications

Freescale Semiconductor 

Power Characteristics

3. Typical power is based on a nominal voltage of VDD = 1.2V, a nominal process, a junction

temperature of Tj = 105° C, and a Dhrystone 2.1 benchmark application.

4. Thermal solutions will likely need to design to a value higher than Typical Power based on the end

application, TA target, and I/O power.

5. Maximum power is based on a nominal voltage of VDD = 1.2V, worst case process, a junction

temperature of Tj = 105° C, and an artificial smoke test.

6. The nominal recommended VDD = 1.3V for this speed grade.

Table 5. Typical I/O Power Dissipation

Interface

DDR I/O

PCI I/O

Local Bus I/O

TSEC I/O

CPM - FCC

Parameters

CCB = 200 MHz

CCB = 266 Mhz

CCB = 300 Mhz

CCB = 333 Mhz

64b, 66Mhz

64b, 33Mhz

32b, 66Mhz

32b, 33Mhz

32b, 167Mhz

32b, 133Mhz

32b, 83Mhz

32b, 66Mhz

32b, 33Mhz

MII

GMII or TBI

RGMII or RTBI

MII

RMII

HDLC 16 Mbps

GVDD OVDD LVDD LVDD

(2.5V) (3.3V) (3.3V) (2.5V)

0.46

0.59

0.66

0.73

0.14

0.08

0.07

0.04

0.30

0.24

0.16

0.13

0.07

0.01

0.07

0.04

0.015

0.013

0.009

Unit

Comments

W—

W—

W—

W—

W—

W—

W Multiply by 2 if using two 32b ports

W

W—

W—

W

W—

W—

W Multiply by number of interfaces

used.

W

W

W—

W—

W—

MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

12

Freescale Semiconductor

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