SL32~SL36
Surface Mount Low VF Schottky Rectifiers
Features
● Low profile package
● Ideal for automated placement
● Ultrafast reverse recovery time
● Low power losses, high efficiency
● Low forward voltage drop
● High surge capability
● High temperature soldering:
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● Case: JEDEC DO-214AC molded plastic
body over glass passivated chip
● Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
● Polarity: Laser band denotes cathode end
Major Ratings and Characteristics
IF(AV)
3.0A
VRRM
20 V to 60 V
IFSM
100A
VF
0.40V, 0.65V
Tj max.
125 °C
Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Items
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
VRRM
VRMS
VDC
IF(AV)
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
IFSM
Voltage rate of change (rated VR)
Thermal resistance from junction to lead(1)
dv/dt
RθJL
SL32
20
14
20
Operating junction and storage temperature range TJ,TSTG
Note 1: Mounted on P.C.B. with 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas.
SL33
30
21
30
3
SL34
40
28
40
100
10000
35
–65 to +125
SL36
60
42
60
UNIT
V
V
V
A
A
V/µs
℃/W
℃
Electrical Characteristics
Items
(TA = 25 °C unless otherwise noted)
Test conditions
Instantaneous forward voltage
Reverse current
IF=3.0A(2)
VR=VDC
TA=25℃
TA=100℃
Note 2: Pulse test:300μs pulse width,1% duty cycle.
Symbol
VF
IR
SL32~34
0.40
1.0
20
SL36
0.65
UNIT
V
mA
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