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SG1842L 查看數據表(PDF) - Microsemi Corporation

零件编号
产品描述 (功能)
生产厂家
SG1842L
Microsemi
Microsemi Corporation Microsemi
SG1842L Datasheet PDF : 24 Pages
First Prev 21 22 23 24
Package Outline Dimensions
Package Outline Dimensions
MILLIMETERS
Dim
MIN MAX
INCHES
MIN
MAX
A
1.35 1.75 0.053
0.069
A1
0.10 0.25 0.004
0.010
A2
1.25 1.52 0.049
0.060
b
0.33 0.51 0.013
0.020
c
0.19 0.25 0.007
0.010
D
4.83 5.21 0.189
0.205
E
5.79 6.20 0.228
0.244
e
1.27 BSC
0.050 BSC
H
3.81 4.01 0.150
0.158
L
0.40 1.27 0.016
0.050
θ
*LC
-
.010
-
0.004
*Lead Co-planarity
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage
Figure 3 · DM 8-Pin SOIC Package Dimensions
MILLIMETERS
Dim
MIN MAX
INCHES
MIN
MAX
A
1.35 1.75 0.053
0.069
A1
0.10 0.25 0.004
0.010
A2
1.25 1.52 0.049
0.060
b
0.33 0.51 0.013
0.020
c
0.19 0.25 0.007
0.010
D
8.54 8.74 0.336
0.344
E
5.79 6.20 0.228
0.244
e
1.27 BSC
0.050 BSC
H
3.81 4.01 0.150
0.158
L
0.40 1.27 0.016
0.050
θ
*LC
-
.010
-
0.004
*Lead Co-planarity
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage
Figure 4 · D 14-Pin SOIC Package Dimensions
21

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