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HFA3127

Ultra High Frequency Transistor Arrays

Renesas Electronics 

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HFA3046, HFA3096, HFA3127, HFA3128

Ultra High Frequency Transistor Arrays

FN3076

Rev 15.00

August 11, 2015

The HFA3046, HFA3096, HFA3127 and the HFA3128 are

Ultra High Frequency Transistor Arrays that are fabricated

from Intersil Corporation’s complementary bipolar UHF-1

process. Each array consists of five dielectrically isolated

transistors on a common monolithic substrate. The NPN

transistors exhibit a fT of 8GHz while the PNP transistors

provide a fT of 5.5GHz. Both types exhibit low noise (3.5dB),

making them ideal for high frequency amplifier and mixer

applications.

The HFA3046 and HFA3127 are all NPN arrays while the

HFA3128 has all PNP transistors. The HFA3096 is an

NPN-PNP combination. Access is provided to each of the

terminals for the individual transistors for maximum

application flexibility. Monolithic construction of these

transistor arrays provides close electrical and thermal

matching of the five transistors.

Intersil provides an Application Note illustrating the use of

these devices as RF amplifiers. For more information, visit

our website at www.intersil.com.

Features

• NPN Transistor (fT) . . . . . . . . . . . . . . . . . . . . . . . . . 8GHz

• NPN Current Gain (hFE). . . . . . . . . . . . . . . . . . . . . . . . 130

• NPN Early Voltage (VA) . . . . . . . . . . . . . . . . . . . . . . . 50V

• PNP Transistor (fT). . . . . . . . . . . . . . . . . . . . . . . . . 5.5GHz

• PNP Current Gain (hFE). . . . . . . . . . . . . . . . . . . . . . . . . 60

• PNP Early Voltage (VA) . . . . . . . . . . . . . . . . . . . . . . . .20V

• Noise Figure (50) at 1.0GHz . . . . . . . . . . . . . . . . . 3.5dB

• Collector to Collector Leakage . . . . . . . . . . . . . . . . . .<1pA

• Complete Isolation Between Transistors

• Pin Compatible with Industry Standard 3XXX Series

Arrays

• Pb-Free (RoHS Compliant)

Applications

• VHF/UHF Amplifiers

• VHF/UHF Mixers

• IF Converters

• Synchronous Detectors

Ordering Information

PART NUMBER

(Note)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

HFA3046BZ

HFA3046BZ

-55 to +125

14 Ld SOIC

M14.15

HFA3096BZ*

HFA3096BZ

-55 to +125

16 Ld SOIC

M16.15

HFA3127BZ*

HFA3127BZ

-55 to +125

16 Ld SOIC

M16.15

HFA3127RZ*

127Z

-55 to +125

16 Ld 3x3 QFN

L16.3x3

HFA3128BZ (No longer

available or supported)

HFA3128BZ

-55 to +125

16 Ld SOIC

M16.15

HFA3128RZ (No longer

available or supported)

128Z

-55 to +125

16 Ld 3x3 QFN

L16.3x3

*Add “96” suffix for tape and reel.

NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%

matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J

STD-020.

FN3076 Rev 15.00

August 11, 2015

Page 1 of 14

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