SN74LS157MR1 查看數據表（PDF） - ON Semiconductor
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SN74LS157MR1 Datasheet PDF : 19 Pages
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www.ti.com
PACKAGE OPTION ADDENDUM
6-Dec-2006
Orderable Device
SNJ54LS157J
SNJ54LS157J
SNJ54LS157W
SNJ54LS157W
SNJ54LS158FK
SNJ54LS158FK
SNJ54LS158J
SNJ54LS158J
SNJ54LS158W
SNJ54LS158W
SNJ54S157FK
SNJ54S157FK
SNJ54S157J
SNJ54S157J
SNJ54S157W
SNJ54S157W
SNJ54S158FK
SNJ54S158J
SNJ54S158W
SNJ54S15FK
SNJ54S15J
SNJ54S15W
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
Package
Type
CDIP
CDIP
CFP
CFP
LCCC
LCCC
CDIP
CDIP
CFP
CFP
LCCC
LCCC
CDIP
CDIP
CFP
CFP
LCCC
CDIP
CFP
LCCC
CDIP
CFP
Package
Drawing
J
J
W
W
FK
FK
J
J
W
W
FK
FK
J
J
W
W
FK
J
W
FK
J
W
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
16
1
TBD
A42
N / A for Pkg Type
20
TBD
Call TI
Call TI
16
TBD
Call TI
Call TI
16
TBD
Call TI
Call TI
20
TBD
Call TI
Call TI
14
TBD
Call TI
Call TI
14
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 4
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