UPD4992CX 查看數據表（PDF） - NEC => Renesas Technology

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UPD4992CX

8-Bit Parallel I/O Calendar Clock

NEC => Renesas Technology 

µPD4992

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

TYPES OF SURFACE MOUNT DEVICE

µPD4992GS

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Soldering condition

Peak package’s surface temperature: 235 °C or below,

Reflow time: 30 seconds or below (210 °C or higher),

Number of reflow process: 2,

Exposure limit*: None

Peak package’s surface temperature: 215 °C or below,

Reflow time: 40 seconds or below (200 °C or higher),

Number of reflow process: 2,

Exposure limit*: None

Solder temperature: 260 °C or below,

Flow time: 10 seconds or below,

Number of flow process: 1,

Exposure limit*: None

Terminal temperature: 300 °C or below,

Flow time: 10 seconds or below,

Exposure limit*: None

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

*: Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 °C and relative humidity at 65 % or less.

Note: Do not apply more than a single process at once, except for “Partial heating method”.

TYPE OF THROUGH HOLE MOUNT DEVICE

µPD4992CX

Soldering process

Wave soldering

Soldering conditions

Solder temperature: 260 °C or below,

Flow time: 10 seconds or below.

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