HCC40106BDG 查看數據表（PDF） - STMicroelectronics
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HCC40106BDG Datasheet PDF : 34 Pages
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Package information
HCC40xxx, HCC45xxx
5.3
Ceramic Flat-16 package information
Figure 5. Ceramic Flat-16 package outline
F
G
D
H
16
A
1
H
9
N
L
8
E
M
B
C
0016030E
1. The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package.
Connecting unused pins or metal lid to ground or to the power supply does not affect the electrical
characteristics.
Table 9. Ceramic Flat-16 mechanical data
Dimensions
Ref
Millimeters
Inches(1)
Min
Typ
Max
A
6.75
B
9.76
C
1.49
D
0.102
6.91
9.94
0.127
7.06
10.14
1.95
0.152
E
8.76
8.89
9.01
F
1.27
G
0.38
0.43
0.48
H
6.0
L
18.75
en
22.0
M
0.33
0.38
0.43
N
4.31
1. Values in inches are rounded to three decimal digits.
Min
0.266
0.384
0.059
0.004
0.345
0.015
0.236
0.738
0.013
Typ
0.272
0.391
0.005
0.350
0.050
0.017
en
0.015
0.170
Max
0.278
0.399
0.077
0.006
0.355
0.019
0.866
0.017
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DocID17102 Rev 7
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