VN610SP13TR(2013) 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

VN610SP13TR
(Rev.:2013)

Single channel high-side solid state relay

STMicroelectronics 

VN610SP

Package and PCB thermal data

4

Package and PCB thermal data

4.1

PowerSO-10 thermal data

Figure 21. PowerSO-10 PC board

Obsolete Product(s) - Obsolete Product(s) Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB

thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm2).

Figure 22. Rthj-amb Vs PCB copper area in open box free air condition

RTHj_amb (°C/W)

55

50

45

40

35

30

Tj-Tamb=50°C

0

2

4

6

8

10

PCB Cu heatsink area (cm^2)

Doc ID 6236 Rev 5

19/26

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