Part C
Substrate Assembly
Encapsulant
View
Pinout Listings
LGA Package
Die
Figure 16. Pinout of the MPC7410, 360 CBGA and 360 HCTE Packages
as Viewed from the Top Surface
6 Pinout Listings
Table 12 provides the pinout listing for the MPC7410 360 CBGA, 360 HCTE packages.
Table 12. Pinout Listing for the MPC7410, 360 CBGA and 360 HCTE Packages
Signal Name
Pin Number
Active
I/O
I/F Select 1 Notes
A[0:31]
AACK
ABB
AP[0:3]
ARTRY
AVDD
BG
BR
BVSEL
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3,
G6, H2, E2, L3, G5, L4, G4, J4, H7, E1, G2, F3, J7, M3, H3,
J2, J6, K3, K2, L2
N3
L7
C4, C5, C6, C7
L6
A8
H1
E7
W1
High
Low
Low
High
Low
—
Low
Low
High
I/O
Input
Output
I/O
I/O
Input
Input
Output
Input
CHK
CI
CKSTP_IN
CKSTP_OUT
CLK_OUT
DBB
DBG
DH[0:31]
K11
C2
B8
D7
E3
K5
K1
W12, W11, V11, T9, W10, U9, U10, M11, M9, P8, W7, P9,
W9, R10, W6, V7, V6, U8, V9, T7, U7, R7, U6, W5, U5, W4,
P7, V5, V4, W3, U4, R5
Low
Low
Low
Low
High
Low
Low
High
Input
I/O
Input
Output
Output
Output
Input
I/O
BVSEL
BVSEL
BVSEL
BVSEL
BVSEL
VDD
BVSEL
BVSEL
N/A
BVSEL
BVSEL
BVSEL
BVSEL
BVSEL
BVSEL
BVSEL
BVSEL
—
12, 16
—
—
—
—
—
1, 3, 8,
9, 14
2, 8, 9
—
—
—
—
12, 16
—
—
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
25