CGY98 查看數據表（PDF） - Infineon Technologies

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CGY98

GaAs MMIC

Infineon Technologies 

GaAs MMIC

CGY 98

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soldering recommendation

• Foot Print

drawing C63060-A2120-A001-01-0027

• Soldering

soldering profile:

wave soldering:

reflow soldering:

(IR or VPR)

unsuitable

suitable, max. 3 times

ramp-up preheating

ramp-up peak

exposure to molten solder

typ. solder temperature

peak temperature

ramp-down

temperature gradient:

time at 100 - 150 °C:

temperature gradient

above 183°C

typ. 215-245°C

max. peak 260°C

temperature gradient:

max. + 2 K/sec

min. 90 sec.

max. + 6 K/sec

max. 150 sec

max. 30 sec.

max. 10 sec.

min. - 6°C/sec

(see also soldering standard profile of databook

‘package information’)

comments

slow ramp-up, long preheating phase and low max.

temperature recommended

• Solder paste thickness

150 - 200 µm

• Control of soldering (voids)

- visual inspection

- cross sectioning

- measurement of case temperature /

thermal resistance case to ambient

• Jedec A-112A

• IPC-9501 (IPC-4202)

level 1

level 111

storage floor life at 30°C/90% unlimited

storage floor life at 30°C/60% unlimited

IR/Convection; max. 245°C; < 6K/sec.

Infenion Technologies AG

GS PD GaAs

16/17

12.05.99

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