NXP Semiconductors
GTL2003
8-bit bidirectional low voltage translator
19. Revision history
Table 16. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
GTL2003 v.2
20120703
Product data sheet
-
Modifications:
• Section 1 “General description”:
GTL2003 v.1
– first paragraph, third sentence changed from “between 1.0 V and 5.0 V” to “between 0.8 V and
5.0 V”
– first paragraph: added (new) fourth sentence.
– second paragraph, third sentence: changed from “VCC” to “VDD1”
• Section 2 “Features and benefits”:
– second bullet: added “0.8 V, 0.9 V”
– tenth bullet: deleted phrase “200 V MM per JESD22-A115”
• Section 3 “Applications”:
– first bullet: changed from “1.0 V” to “0.8 V” (two places)
– second bullet: added “0.8 V, 0.9 V”
• Table 5 “Function selection, LOW-to-HIGH translation”, Table note [3]: changed from “VCC” to
“VDD1”
• Section 8.1 “Bidirectional translation”:
– first sentence: changed from “VCC” to “VDD1”
– third sentence: changed from “VCC” to “VDD1”
– seventh sentence re-written
– eighth sentence re-written
– added (new) ninth sentence
– Figure 4 “Bidirectional translation to multiple higher voltage levels such as an I2C-bus
application” updated
• Section 8.2 “Unidirectional down translation”:
– first sentence: changed from “VCC” to “VDD1”
– fifth sentence re-written (split into fifth and sixth sentences)
– added (new) seventh sentence
– Figure 5 “Unidirectional down translation to protect low voltage processor pins” updated
• Figure 6 “Unidirectional down translation to protect low voltage processor pins” updated
• Section 8.4 “Sizing pull-up resistor”:
– added (new) second paragraph
– third paragraph, first sentence: appended “for VDD1 VSREF 1.5 V”
– Table 6 “Pull-up resistor values”: added six rows, 1.1 V through 0.8 V
• Table 8 “Recommended operating conditions”: added row VSn
• Table 9 “Static characteristics”:
– Conditions for Ron: changed from “VI” to “VSn”
• Figure 9 “Load circuit for translator-type applications”: corrected resistors’ values from “150 k” to
“150 ” (3 places)
• Added Section 16 “Soldering: PCB footprints”
• Added Section 18 “References”
GTL2003_1
20070727
Product data sheet
-
-
GTL2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 July 2012
© NXP B.V. 2012. All rights reserved.
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