CXB1577R 查看數據表（PDF） - Sony Semiconductor
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CXB1577R Datasheet PDF : 21 Pages
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CXB1577R
Package Outline
Unit: mm
32PIN LQFP (PLASTIC)
7.0
5.0
B
24
17
25
A
16
A
32
9
1
X4
0.2 S A B
0.5
8
X4
0.2 S A B
0.08 M S A B
0.25
0.1 ± 0.05
0.2 ± 0.03
(0.2)
1.7MAX
S
0.08 S
B
0° to 8°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
LQFP-32P-L01
LQFP032-P-0505
DETAIL B
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
PALLADIUM PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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